Fan-out wafer-level packaging
INTEGRATED CIRCUIT PACKAGING TECHNOLOGY
Wafer-level fan-out packaging; Fan-out WLP; FOWL packaging; FO-WLP; FOWLP
Fan-out wafer-level packaging (also known as wafer-level fan-out packaging, fan-out WLP, FOWL packaging, FO-WLP, FOWLP, etc.) is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions.