Σε αυτήν τη σελίδα μπορείτε να λάβετε μια λεπτομερή ανάλυση μιας λέξης ή μιας φράσης, η οποία δημιουργήθηκε χρησιμοποιώντας το ChatGPT, την καλύτερη τεχνολογία τεχνητής νοημοσύνης μέχρι σήμερα:
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach.