Μετάφραση και ανάλυση λέξεων από την τεχνητή νοημοσύνη ChatGPT
Σε αυτήν τη σελίδα μπορείτε να λάβετε μια λεπτομερή ανάλυση μιας λέξης ή μιας φράσης, η οποία δημιουργήθηκε χρησιμοποιώντας το ChatGPT, την καλύτερη τεχνολογία τεχνητής νοημοσύνης μέχρι σήμερα:
- πώς χρησιμοποιείται η λέξη
- συχνότητα χρήσης
- χρησιμοποιείται πιο συχνά στον προφορικό ή γραπτό λόγο
- επιλογές μετάφρασης λέξεων
- παραδείγματα χρήσης (πολλές φράσεις με μετάφραση)
- ετυμολογία
surface mount - translation to ρωσικά
![Surface-mount [[capacitor]]](https://commons.wikimedia.org/wiki/Special:FilePath/Big SMD capacitor 2.jpg?width=200 "Surface-mount [[capacitor]]")
![Assembly line with [[pick-and-place machine]]s](https://commons.wikimedia.org/wiki/Special:FilePath/Juki KE-2080L by Megger.jpg?width=200 "Assembly line with [[pick-and-place machine]]s")
![A [[MOSFET]] [[transistor]], placed upon a British postage stamp for size comparison.](https://commons.wikimedia.org/wiki/Special:FilePath/SMDcompared.jpeg?width=200 "A [[MOSFET]] [[transistor]], placed upon a British postage stamp for size comparison.")
![two-terminal packages]] and comparison included](https://commons.wikimedia.org/wiki/Special:FilePath/SMT sizes, based on original by Zureks.svg?width=200 "two-terminal packages]] and comparison included")
![soldering tweezers]]](https://commons.wikimedia.org/wiki/Special:FilePath/Soldering a 0805.jpg?width=200 "soldering tweezers]]")
общая лексика
наземный
общая лексика
прибор для монтажа на поверхности
Ορισμός
Βικιπαίδεια
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.
An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.
