Head-in-pillow defect
FAILURE OF THE SOLDERING PROCESS
Head in pillow (metallurgy); Head in pillow defect; Head in pillow; Head-in-pillow failure; Head-in-pillow failure mode; Head-in-pillow failure mechanism; Head in pillow failure; Head in pillow failure mode; Head in pillow failure mechanism; Head-in-pillow soldering defect; Head in pillow soldering defect; Head-in-pillow BGA defect; Head in pillow BGA defect; Ball-and-socket (electronics); Ball-and-socket defect (electronics)
In the assembly of integrated circuit packages to printed circuit boards, a head-in-pillow defect (HIP or HNP) is a failure of the soldering process. For example, in the case of a ball grid array (BGA) package, the pre-deposited solder ball on the package and the solder paste applied to the circuit board may both melt, but the melted solder does not join.