random access - определение. Что такое random access
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Что (кто) такое random access - определение

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Random access         
ABILITY TO ACCESS AN ARBITRARY ELEMENT OF A SEQUENCE IN EQUAL TIME
Random-access storage; Random access file; Random-access; Random I/O; Random read; Random write; Direct access (computing)
Random access (more precisely and more generally called direct access) is the ability to access an arbitrary element of a sequence in equal time or any datum from a population of addressable elements roughly as easily and efficiently as any other, no matter how many elements may be in the set. In computer science it is typically contrasted to sequential access which requires data to be retrieved in the order it was stored.
random access         
ABILITY TO ACCESS AN ARBITRARY ELEMENT OF A SEQUENCE IN EQUAL TIME
Random-access storage; Random access file; Random-access; Random I/O; Random read; Random write; Direct access (computing)
¦ noun Computing the process of transferring information to or from memory in which every memory location can be accessed directly rather than being accessed in a fixed sequence.
parallel random-access machine         
ABSTRACT COMPUTER FOR DESIGNING PARALLEL ALGORITHMS
Parallel random access machine; Exclusive Read Exclusive Write; Concurrent Read Exclusive Write; Concurrent Read Concurrent Write; EREW; CRCW; Parallel random access model; Concurrent read, exclusive write; ERCW; Concurrent read, concurrent write; Exclusive read, concurrent write; Exclusive read, exclusive write; CRCW-PRAM; CRCW PRAM; EREW-PRAM; EREW PRAM; CREW-PRAM; CREW PRAM; ERCW-PRAM; ERCW PRAM; Concurrent random access machine; Parallel Random Access Machine; Parallel random-access machine
<parallel> (PRAM) An idealised parallel processor consisting of P processors, unbounded shared memory, and a common clock. Each processor is a random-access machine (RAM) consisting of R registers, a program counter, and a read-only signature register. Each RAM has an identical program, but the RAMs can branch to different parts of the program. The RAMs execute the program synchronously one instruction in one clock cycle. See also pm2. (1997-06-04)
static random-access memory         
  • Four-transistor SRAM provides advantages in density at the cost of manufacturing complexity. The resistors must have small dimensions and large values.
  • A six-transistor CMOS SRAM cell. WL: word line. BL: bit line.
  • die]] of a STM32F103VGT6 [[microcontroller]] as seen by a [[scanning electron microscope]]. Manufactured by [[STMicroelectronics]] using a 180-[[nanometre]] process. Topology of the cells is clearly visible.
SEMICONDUCTOR MEMORY THAT USES FLIP-FLOPS TO STORE EACH BIT
Static RAM; S-RAM; Static Random Access Memory; SRAM latency; RSNM; Read static noise margin; Static random access memory; Static storage; ESRAM; 6T SRAM; 6T SRAM cell; 6T RAM cell
<storage> (SRAM) Random-access memory in which each bit of storage is a bistable flip-flop, commonly consisting of cross-coupled inverters. It is called "static" because it will retain a value as long as power is supplied, unlike dynamic random-access memory (DRAM) which must be regularly refreshed. It is however, still volatile, i.e. it will lose its contents when the power is switched off, in contrast to ROM. SRAM is usually faster than DRAM but since each bit requires several transistors (about six) you can get less bits of SRAM in the same area. It usually costs more per bit than DRAM and so is used for the most speed-critical parts of a computer (e.g. cache memory) or other circuit. (1995-04-22)
dynamic random-access memory         
  • [[MoSys]] MDRAM MD908
  • accessdate=2022-03-09}}</ref> (lower edge, right of middle).
  • 1 Mbit high speed [[CMOS]] pseudo static RAM, made by [[Toshiba]]
  • NMOS]] DRAM cell. It was patented in 1968.
  • die]] of a Samsung DDR-SDRAM 64MBit package
  • Inside a Samsung GDDR3 256&nbsp;MBit package
  • A 512 MBit [[Qimonda]] GDDR3 SDRAM package
  • Writing to a DRAM cell
RANDOM-ACCESS MEMORY THAT STORES EACH BIT OF DATA IN A SEPARATE CAPACITOR WITHIN AN INTEGRATED CIRCUIT
DRAM (memory); Pseudostatic RAM; PSRAM; Pseudostatic Random Access Memory; Window RAM; Dynamic RAM; EDO RAM; Fast Page Mode DRAM; FPM RAM; FPM DRAM; Fast Page Mode RAM; BEDO (RAM); MDRAM; Row Access Strobe; Column Access Strobe; CAS access time; Precharge interval; Row address select; Column address select; 1T DRAM; DDRAM; D-RAM; EDO DRAM; Fast page mode; Page mode memory; Extended Data Out RAM; BEDO RAM; Burst EDO; Multibank DRAM; Intel 1102; Burst EDO DRAM; Memory Timing; Dynamic Random Access Memory; FPRAM; Dynamic random access memory; Extended data out DRAM; Extended Data Out DRAM; Dynamic Random access memory; Static column RAM; Memory row; DRAM row; Row activation; WRAM (memory); 1T1C; 1t1c; 3T1C; Page mode RAM; Page mode DRAM; DRAM; D. R. A. M.; D.R.A.M.; DRAM memory; Asynchronous DRAM; EDO memory; Fast page mode DRAM; Window DRAM; Video DRAM; Nibble mode; EDO SGRAM
<storage> (DRAM) A type of semiconductor memory in which the information is stored in capacitors on a MOS {integrated circuit}. Typically each bit is stored as an amount of electrical charge in a storage cell consisting of a capacitor and a transistor. Due to leakage the capacitor discharges gradually and the memory cell loses the information. Therefore, to preserve the information, the memory has to be refreshed periodically. Despite this inconvenience, the DRAM is a very popular memory technology because of its high density and consequent low price. The first commercially available DRAM chip was the {Intel 1103}, introduced in 1970. Early DRAM chips, containing up to a 16k x 1 (16384 locations of one bit each), needed 3 supply voltages (+5V, -5V and +12V). Beginning with the 64 kilobit chips, charge pumps were included on-chip to create the necessary supply voltages out of a single +5V supply. This was necessary to fit the device into a 16-pin DIL package, which was the preferred package at the time, and also made them easier to use. To reduce the pin count, thereby helping miniaturisation, DRAMs generally had a single data line which meant that a computer with an N bit wide data bus needed a "bank" of (at least) N DRAM chips. In a bank, the address and control signals of all chips were common and the data line of each chip was connected to one of the data bus lines. Beginning with the 256 kilobit DRAM, a tendency toward surface mount packaging arose and DRAMs with more than one data line appeared (e.g. 64k x 4), reducing the number of chips per bank. This trend has continued and DRAM chips with up to 36 data lines are available today. Furthermore, together with surface mount packages, memory manufacturers began to offer memory modules, where a bank of memory chips was preassembled on a little printed circuit board (SIP = Single Inline Pin Module, SIMM = Single Inline Memory Module, DIMM = Dual Inline Memory Module). Today, this is the preferred way to buy memory for workstations and {personal computers}. DRAM bit cells are arranged on a chip in a grid of rows and columns where the number of rows and columns are usually a power of two. Often, but not always, the number of rows and columns is the same. A one megabit device would then have 1024 x 1024 memory cells. A single memory cell can be selected by a 10-bit row address and a 10-bit column address. To access a memory cell, one entire row of cells is selected and its contents are transferred into an on-chip buffer. This discharges the storage capacitors in the bit cells. The desired bits are then read or written in the buffer. The (possibly altered) information is finally written back into the selected row, thereby refreshing all bits (recharging the capacitors) in the row. To prevent data loss, all bit cells in the memory need to be refreshed periodically. This can be done by reading all rows in regular intervals. Most DRAMs since 1970 have been specified such that one of the rows needs to be refreshed at least every 15.625 microseconds. For a device with 1024 rows, a complete refresh of all rows would then take up to 16 ms; in other words, each cell is guaranteed to hold the data for 16 ms without refresh. Devices with more rows have accordingly longer retention times. Many varieties of DRAM exist today. They differ in the way they are interfaced to the system - the structure of the memory cell itself is essentially the same. "Traditional" DRAMs have multiplexed address lines and separate data inputs and outputs. There are three control signals: RAS (row address strobe), CAS (column address strobe), and WE (write enable) (the backslash indicates an active low signal). Memory access procedes as follows: 1. The control signals initially all being inactive (high), a memory cycle is started with the row address applied to the address inputs and a falling edge of RAS . This latches the row address and "opens" the row, transferring the data in the row to the buffer. The row address can then be removed from the address inputs since it is latched on-chip. 2. With RAS still active, the column address is applied to the address pins and CAS is made active as well. This selects the desired bit or bits in the row which subsequently appear at the data output(s). By additionally activating WE the data applied to the data inputs can be written into the selected location in the buffer. 3. Deactivating CAS disables the data input and output again. 4. Deactivating RAS causes the data in the buffer to be written back into the memory array. Certain timing rules must be obeyed to guarantee reliable operation. 1. RAS must remain inactivate for a while before the next memory cycle is started to provide sufficient time for the storage capacitors to charge (Precharge Time). 2. It takes some time from the falling edge of the RAS or CAS signals until the data appears at the data output. This is specified as the Row Access Time and the Column Access Time. Current DRAM's have Row Access Times of 50-100 ns and Column Access Times of 15-40 ns. Speed grades usually refer to the former, more important figure. Note that the Memory Cycle Time, which is the minimum time from the beginning of one access to the beginning of the next, is longer than the Row Access Time (because of the Precharge Time). Multiplexing the address pins saves pins on the chip, but usually requires additional logic in the system to properly generate the address and control signals, not to mention further logic for refresh. Therefore, DRAM chips are usually preferred when (because of the required memory size) the additional cost for the control logic is outweighed by the lower price. Based on these principles, chip designers have developed many varieties to improve performance or ease system integration of DRAMs: PSRAMs (Pseudo Static Random Access Memory) are essentially DRAMs with a built-in address multiplexor and refresh controller. This saves some system logic and makes the device look like a normal SRAM. This has been popular as a lower cost alternative for SRAM in embedded systems. It is not a complete SRAM substitute because it is sometimes busy when doing self-refresh, which can be tedious. Nibble Mode DRAM can supply four successive bits on one data line by clocking the CAS line. Page Mode DRAM is a standard DRAM where any number of accesses to the currently open row can be made while the RAS signal is kept active. Static Column DRAM is similar to Page Mode DRAM, but to access different bits in the open row, only the column address needs to be changed while the CAS signal stays active. The row buffer essentially behaves like SRAM. Extended Data Out DRAM (EDO DRAM) can continue to output data from one address while setting up a new address, for use in pipelined systems. DRAM used for Video RAM (VRAM) has an additional long shift register that can be loaded from the row buffer. The shift register can be regarded as a second interface to the memory that can be operated in parallel to the normal interface. This is especially useful in frame buffers for CRT displays. These frame buffers generate a serial data stream that is sent to the CRT to modulate the electron beam. By using the shift register in the VRAM to generate this stream, the memory is available to the computer through the normal interface most of the time for updating the display data, thereby speeding up display data manipulations. SDRAM (Synchronous DRAM) adds a separate clock signal to the control signals. It allows more complex state machines on the chip and high speed "burst" accesses that clock a series of successive bits out (similar to the nibble mode). CDRAM (Cached DRAM) adds a separate static RAM array used for caching. It essentially combines main memory and cache memory in a single chip. The cache memory controller needs to be added externally. RDRAM (Rambus DRAM) changes the system interface of DRAM completely. A byte-wide bus is used for address, data and command transfers. The bus operates at very high speed: 500 million transfers per second. The chip operates synchronously with a 250MHz clock. Data is transferred at both rising and falling edges of the clock. A system with signals at such frequencies must be very carefully designed, and the signals on the Rambus Channel use nonstandard signal levels, making it incompatible with standard system logic. These disadvantages are compensated by a very fast data transfer, especially for burst accesses to a block of successive locations. A number of different refresh modes can be included in some of the above device varieties: RAS only refresh: a row is refreshed by an ordinary read access without asserting CAS. The data output remains disabled. CAS before RAS refresh: the device has a built-in counter for the refresh row address. By activating CAS before activating RAS, this counter is selected to supply the row address instead of the address inputs. Self-Refresh: The device is able to generate refresh cycles internally. No external control signal transitions other than those for bringing the device into self-refresh mode are needed to maintain data integrity. (1996-07-11)
Random-access channel         
A random-access channel (RACH) is a shared channel used by wireless terminals to access the mobile network (TDMA/FDMA, and CDMA based network) for call set-up and bursty data transmission. Whenever mobile wants to make an MO (Mobile Originating) call it schedules the RACH.
random-access memory         
  • VEB Carl Zeiss Jena]] in 1989
  • DRAM Cell (1 Transistor and one capacitor)
  • These IBM [[tabulating machine]]s from the mid-1930s used [[mechanical counter]]s to store information
  • heatsink]]
  • SRAM Cell (6 Transistors)
  • desktop RAM]].
  • server]]s.
FORM OF COMPUTER DATA STORAGE
R.A.M.; Shadow Random Access Memory; Memory wall; Shadow ram; Shadow RAM; Shadow random access memory; Random-Access Memory; RAM chip; Random Access Memory; RAM (memory); Sigmaquad; Random access memory; Single sided RAM; Single-sided RAM; Single sided random access memory; Single-sided random access memory; RAM memory; Computer RAM memory; RAM; Memory bottleneck; History of random-access memory; RAM IC; RAM stick
<storage> (RAM) (Previously "direct-access memory"). A data storage device for which the order of access to different locations does not affect the speed of access. This is in contrast to, say, a magnetic disk, magnetic tape or a mercury delay line where it is very much quicker to access data sequentially because accessing a non-sequential location requires physical movement of the storage medium rather than just electronic switching. In the 1970s magnetic core memory was used and some old-timers still call RAM "core". The most common form of RAM in use today is semiconductor integrated circuits, which can be either static random-access memory (SRAM) or {dynamic random-access memory} (DRAM). The term "RAM" has gained the additional meaning of read-write. Most kinds of semiconductor read-only memory (ROM) are actually "random access" in the above sense but are never referred to as RAM. Furthermore, memory referred to as RAM can usually be read and written equally quickly (approximately), in contrast to the various kinds of programmable read-only memory. Finally, RAM is usually volatile though non-volatile random-access memory is also used. Interestingly, some DRAM devices are not truly random access because various kinds of "page mode" or "column mode" mean that sequential access is faster than random access. The humorous expansion "Rarely Adequate Memory" refers to the fact that programs and data always seem to expand to fill the memory available. (2007-10-12)
Random-access stored-program machine         
In theoretical computer science the random-access stored-program (RASP) machine model is an abstract machine used for the purposes of algorithm development and algorithm complexity theory.
CREW PRAM         
ABSTRACT COMPUTER FOR DESIGNING PARALLEL ALGORITHMS
Parallel random access machine; Exclusive Read Exclusive Write; Concurrent Read Exclusive Write; Concurrent Read Concurrent Write; EREW; CRCW; Parallel random access model; Concurrent read, exclusive write; ERCW; Concurrent read, concurrent write; Exclusive read, concurrent write; Exclusive read, exclusive write; CRCW-PRAM; CRCW PRAM; EREW-PRAM; EREW PRAM; CREW-PRAM; CREW PRAM; ERCW-PRAM; ERCW PRAM; Concurrent random access machine; Parallel Random Access Machine; Parallel random-access machine
concurrent read, exclusive write PRAM.
Resistive random-access memory         
  • date=May 2017}} the instance of filament forming when the current abruptly increases beyond a certain voltage. A transistor is often used to limit current to prevent a runaway breakdown following the filament formation.
NON-VOLATILE MEMORY TYPE
Resistive RAM; RRAM; Resistive Random Access Memory; ReRAM
Resistive random-access memory (ReRAM or RRAM) is a type of non-volatile (NV) random-access (RAM) computer memory that works by changing the resistance across a dielectric solid-state material, often referred to as a memristor.